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The Solid-State Electrocaloric Refrigeration With Unimorph Beam and its Analytical Model

[+] Author Affiliations
Zhimin Sun, Qing-Ming Wang, William S. Slaughter

University of Pittsburgh, Pittsburgh, PA

Paper No. IMECE2018-88634, pp. V08AT10A060; 5 pages
doi:10.1115/IMECE2018-88634
From:
  • ASME 2018 International Mechanical Engineering Congress and Exposition
  • Volume 8A: Heat Transfer and Thermal Engineering
  • Pittsburgh, Pennsylvania, USA, November 9–15, 2018
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5211-8
  • Copyright © 2018 by ASME

abstract

Electrocaloric (EC) cooling technology, which has reversible temperature change of a polarizable material in an adiabatic condition with the application and/or removal of an electric field, exhibits some great advantages for efficient solid-state refrigeration. However, many challenges still exist in EC cooling technology. One of the main challenges is how to control the heat transfer direction. Some of the reported device types require movement of EC material by step motor or fluid media by pump back and forth between heat source and heat sink for controlling heat transfer direction. The other device designs utilize thermal diodes by adjusting their thermal conductivity to control heat transfer direction. Here we report a solid-state electrocaloric refrigeration using unimorph beam structure which has temperature change due to EC effect and bending behavior due to converse piezoelectric effect. The new device design can eliminate problems of fluid medium loss, friction, high thermal conductivity ratio requirement and external system assistance, etc., existed in the previously reported EC cooling device types. An analytical model is also derived by considering multi-physical phenomenon. The model shows that the temperature change is a combinatorial result from the couplings of thermal, electric and mechanical field in the device.

Copyright © 2018 by ASME
Topics: Refrigeration

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