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Active Hot Spot Cooling Controlled by Single-Sided Electrowetting-on-Dielectric (SEWOD)

[+] Author Affiliations
Sung-Yong Park

Teledyne Scientific & Imaging, Thousand Oaks, CA

Jiangtao Cheng

University of North Texas, Denton, TX

Chung-Lung (C.-L. ) Chen

University of Missouri, Columbia, MO

Paper No. HT2012-58111, pp. 617-623; 7 pages
  • ASME 2012 Heat Transfer Summer Conference collocated with the ASME 2012 Fluids Engineering Division Summer Meeting and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels
  • Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer
  • Rio Grande, Puerto Rico, USA, July 8–12, 2012
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4478-6
  • Copyright © 2012 by ASME


Electrowetting-on-dielectric (EWOD) has attracted as one of the effective on-chip cooling technologies. It enables rapid transport of coolant droplets and heat transfer from target heat sources, while consuming extremely low power for fluid transport. However, a sandwiched configuration in conventional EWOD devices only allows sensible heat transfer, which very limits heat transfer capability of the device. In this paper, we report a novel single-sided EWOD (SEWOD) technology that enables two-phase cooling on a single-sided plate. As a result, heat transfer capability of the SEWOD device can be significantly enhanced. A complete set of droplet manipulation functions necessary for active hot spot cooling has been achieved on SEWOD. Hot spot surface modification to hydrophilic makes a droplet stick on a hot spot and maximize its contact area, greatly improving thermal rejection capability of the device. We have demonstrated two-phase cooling on SEWOD. With successive transportation of four droplets with a volume of 30 μL, the hot spot temperature that was initially heated up to 172°C was able to be stably maintained below 100 °C for 475s. This novel SEWOD-driven cooling technique promises to potentially function as a wickless vapor chamber with enhanced thermal managing capabilities.

Copyright © 2012 by ASME
Topics: Cooling



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