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Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

[+] Author Affiliations
Gongnan Xie, Weihong Zhang

Northwestern Polytechnical University, Xi’an, China

Yanquan Liu

Xi’an Jiaotong University, Xi’an, China

Bengt Sunden

Lund University, Lund, Sweden

Jun Zhao

Huawei Technologies Co., Ltd., Shenzhen, China

Paper No. HT2012-58021, pp. 575-583; 9 pages
  • ASME 2012 Heat Transfer Summer Conference collocated with the ASME 2012 Fluids Engineering Division Summer Meeting and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels
  • Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer
  • Rio Grande, Puerto Rico, USA, July 8–12, 2012
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4478-6
  • Copyright © 2012 by ASME


The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.

Copyright © 2012 by ASME



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