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Optimal Hardware Placement in a Minitower Computer Enclosure System

[+] Author Affiliations
M. Alfaro Cano

Schneider Electric R&D, Apodaca, NLE, Mexico

A. Hernandez-Guerrero, C. Rubio Arana

University of Guanajuato, Salamanca, GUA, Mexico

Aristotel Popescu

“Gheorghe Asachi” Technical University of Iaşi, Iaşi, Romania

Paper No. IMECE2011-65544, pp. 1027-1034; 8 pages
  • ASME 2011 International Mechanical Engineering Congress and Exposition
  • Volume 4: Energy Systems Analysis, Thermodynamics and Sustainability; Combustion Science and Engineering; Nanoengineering for Energy, Parts A and B
  • Denver, Colorado, USA, November 11–17, 2011
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5490-7
  • Copyright © 2011 by ASME


One of the requirements for existing personal computers, PCs, is that the hardware inside must maintain an operating temperature as low as possible. One way to achieve that is to place the hardware components at locations with enough airflow around it. However, the relationship between the airflow and temperature of the components is unknown before they are placed at specific locations inside a PC. In this work a Computational Fluid Dynamics (CFD) analysis is coupled to a Design of Experiment (DOE) methodology to answer typical minitower key questions: a) how do the possible positions of hardware components affect their temperature?, and b) is it possible to get an optimal placement for these hardware components using the data collected by the CFD simulation results? The DOE methodology is used to optimize the analysis for a very large number of possible configurations. The results help in identifying where the efforts need to be placed in order to optimize the positioning of the hardware components for similar configurations at the designing stage. Somehow the results show that general conclusions could be drawn, but that there are not specific rules that could be applied to every configuration.

Copyright © 2011 by ASME
Topics: Hardware , Computers



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