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Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads

[+] Author Affiliations
Vikram Srinivas, Moustafa Al-Bassyiouni, Michael Osterman, Michael Pecht

CALCE, University of Maryland, College Park, MD

Paper No. IMECE2009-11376, pp. 211-216; 6 pages
  • ASME 2009 International Mechanical Engineering Congress and Exposition
  • Volume 5: Electronics and Photonics
  • Lake Buena Vista, Florida, USA, November 13–19, 2009
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4378-9 | eISBN: 978-0-7918-3863-1
  • Copyright © 2009 by ASME


Mechanical torsion loads often arise in portable electronics under life cycle conditions. With increased market pressure, drive to reduce time to market, and varying use conditions, it is critical to develop accelerated tests to evaluate reliability quickly. Mechanical torsion testing can provide a rapid assessment technique to characterize solder interconnect durability. This paper presents an evaluation of select lead-free solders, SAC305 (96.5Sn-3.0Ag-0.5Cu) and SN100C (99.25Sn-0.7Cu-0.05Ni+Ge), under mechanical torsion loading. For comparison, SnPb (63Sn-37Pb) solder was also evaluated. Common test vehicles with resistor 2512 packages were used for these tests. For the mechanical cycle tests, no statistical difference in reliability was observed between SAC305 and SnPb solder paste while SN100C solder pastes were found to exhibit lower durability during Weibull analysis.

Copyright © 2009 by ASME



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