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Reducing Material Waste Using Six Sigma in Printed Circuit Board Assembly

[+] Author Affiliations
Naji E. Gebara, Badih Jawad

Lawrence Technological University, Southfield, MI

Paper No. IMECE2007-42680, pp. 187-195; 9 pages
doi:10.1115/IMECE2007-42680
From:
  • ASME 2007 International Mechanical Engineering Congress and Exposition
  • Volume 3: Design and Manufacturing
  • Seattle, Washington, USA, November 11–15, 2007
  • Conference Sponsors: ASME
  • ISBN: 0-7918-4297-5 | eISBN: 0-7918-3812-9
  • Copyright © 2007 by ASME

abstract

Material waste in the Printed Circuit Board Assembly consist of parts and components that are purchased above and beyond what is required to complete a project. Controlling such material waste identified in this paper as Quantity Variance is in a direct relationship to minimizing the cost of variance that increases the profitability of each job in a low volume high mix production. This Quantity Variance occurs as defects at key steps of the manufacturing process. Six sigma is used to define, measure, analyze and control occurrences resulting in the need to purchase additional components for the completion of the order.

Copyright © 2007 by ASME

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