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On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires

[+] Author Affiliations
C. J. Hang, I. Lum, J. Lee, M. Mayer, Y. Zhou

University of Waterloo, Waterloo, ON, Canada

C. Q. Wang

Harbin Institute of Technology, Harbin, Heilongjiang, China

S. J. Hong, S. M. Lee

MK Electron Company, Ltd., Yongin, Gyeonggi, South Korea

Paper No. IPACK2007-33046, pp. 25-30; 6 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME


In order to eliminate the chip cratering for copper wire applications in IC packaging, it is worthwhile to develop new Cu wire chemistries to obtain a soft copper wire with a soft free-air ball (FAB). The conventional hardness characterization of a new bonding wire is a labour intensive, time-consuming work. Therefore an on-line hardness characterization method is presented that enables the hardness comparison of a larger number of different wires within a shorter time. The influences of capillary change, bonding substrate metallization and temperature on this method is quantified. It is found these influences need to be held constant during a hardness comparison study. With this method, the wire and FAB hardness comparison of nine novel 2-mil copper bonding wires, Cu 1 to Cu 9, and one 2-mil Au wire are performed. The wire hardness (wireside) and FAB hardness are characterized. It is found that the Cu 4 and Cu 5 have the softest wireside hardness and FAB hardness.

Copyright © 2007 by ASME
Topics: Copper , Bonding , Wire



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