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Electrical, Optical and Thermofluidic Chip I/O Interconnections

[+] Author Affiliations
Muhannad S. Bakir, Bing Dang, James D. Meindl

Georgia Institute of Technology, Atlanta, GA

Paper No. IPACK2007-33464, pp. 11-17; 7 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME


This paper describes microscale fluidic chip I/O interconnects to enable the delivery of a coolant from substrate-level fluidic channels to a CMOS chip with an integrated silicon microchannel heat sink. It is shown that the fluidic I/Os are flip-chip compatible and can be assembled simultaneously with C4 bumps. The cooling of >300 W/cm2 is demonstrated using the microfluidic chip I/Os. Their compatibility with optical I/Os and the mechanical compliance characterization of the optical I/Os are also described. Experimental research is reported in the fabrication, assembly, and testing of a chip with electrical and fluidic I/O interconnects.

Copyright © 2007 by ASME



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