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A Statistical Approach to Improve Wafer Fabrication Yield

[+] Author Affiliations
Nael Barakat

Lake Superior State University, Sault Ste. Marie, MI

Hesham Enshasy

Integrated Management Associates, Whitehall, PA

Paper No. IMECE2002-39275, pp. 79-84; 6 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


In spite of the recent advancements in wafer fabrication techniques, devices are still being individually checked and modified. This is due to the fact that the general manufacturing processes involved in wafer production have their inherent inconsistencies. As a consequence, individual devices show differences in characteristics that would render a big group of them operating out of the range of the pre-set spec limits. Therefore they would require types of modifications specific to the individual device. Knowing that the resources spent on checking and eliminating out-of-spec devices before they reach the customer are very significant, the manufacturing operation becomes hardly profitable. These wafers normally carry devices in the range of a thousand or so, making a statistical approach very attractive. In this paper, an actual industrial problem in wafer fabrication to the desired specifications is presented. The problem shows in passive filters built using Surface Acoustic Wave (SAW) theory. A solution considering a statistical process control approach to the population of devices on the wafer is proposed. The results of applying this solution are realized in significant product yield increase, huge cost cutting, and automation promotion and application.

Copyright © 2002 by ASME



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