Full Content is available to subscribers

Subscribe/Learn More  >

Miniaturized Thermoelectric Cooler

[+] Author Affiliations
Luciana W. da Silva, Massoud Kaviany

University of Michigan, Ann Arbor, MI

Paper No. IMECE2002-32437, pp. 249-263; 15 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 1
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3632-0 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


Vapor-deposited bismuth telluride (n-type) and antimony telluride (p-type) films are used in a micro, column-type, patterned thermoelectric cooler. The optimum number of thermoelectric pairs and operating current are predicted. Such devices contain a number of metal/thermoelectric and metal/elecrical-insulator interfaces. In the analysis, various interfacial resistances (phonon and electron boundary resistances and thermal and electrical contact resistances) have been included. The boundary resistances cause a reduction in the thermal conductivity (desirable) and a reduction in the Seebeck coefficient (undesirable) of the thermoelectric elements. The contact resistances reduce the overall device performance. In the fabrication, the stoichiometry of the deposited thermoelectric films, the patterned film deposition, and the selection of the conducting connectors, are discussed. The thermoelectric films are about 4 μm thick and are deposited on patterned platinum (first trial layer for connectors), which are in turn deposited on oxide coated silicon wafers. The top, suspended connectors that close the electrical circuit are bonded to the surface to be cooled. The non-uniformity of the composition in the thermoelectric films influences the measured Seebeck coefficients. The analysis shows that a coefficient of performance of 0.38 is obtainable for a wireless micro sensor application.

Copyright © 2002 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In