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Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy

[+] Author Affiliations
Y.-L. Shen, K. C. R. Abell

University of New Mexico, Albuquerque, NM

S. E. Garrett

Sandia National Laboratories, Albuquerque, NM

Paper No. IMECE2002-32885, pp. 71-78; 8 pages
doi:10.1115/IMECE2002-32885
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Applied Mechanics and Biomedical Technology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Applied Mechanics Division
  • ISBN: 0-7918-3627-4 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

Experiments on the eutectic tin-lead alloy were conducted to study the effects of grain boundary sliding on the deformation and damage processes at the microscopic level. The primary objective is to gain mechanistic understandings of solder joint reliability in microelectronic packaging. Bulk specimens were subject to relatively fast deformations of tension, compression and bending, for the purposes of examining the pure mechanical effect without the influence of diffusion related phenomena. Grain realignment and phase redistribution were characterized by microscopy and microhardness indentation. A micromechanical model is proposed to elucidate the observed microstructural changes and progressive damage. This study illustrates the significance of damage in the form of microscopic heterogeneity caused by grain boundary sliding. It also illustrates the possibility of mechanically induced phase coarsening in actual solder joints. High-frequency cyclic shear tests on tin-lead solder joints showed damage along the coarsened band after only a short time, in accord with the proposed effects. Boundary sliding without the influence of atomic diffusion plays an essential role in fatigue damage in solder.

Copyright © 2002 by ASME

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