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Microstructural Damage and Evolution of a PbSn Solder Alloy Under Isothermal Cyclic Loading

[+] Author Affiliations
T. Jesse Lim, Wei-Yang Lu

Sandia National Laboratories, Livermore, CA

Paper No. IMECE2002-32867, pp. 55-60; 6 pages
doi:10.1115/IMECE2002-32867
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Applied Mechanics and Biomedical Technology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Applied Mechanics Division
  • ISBN: 0-7918-3627-4 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

In our recent experiments, torsional specimens of PbSn Solder Alloy were cyclically loaded under different loading levels at both room temperature and high temperature (1008C). In these experiments, the Pb-rich phase size and micro-crack damage were also observed using scanning electron microscopy in-between loading cycles. At the moderate strain rate (10−4 ), the growth of Pb-rich phase does not differ much for both temperatures. At room temperature, the damage in the form of micro-cracks along the Pb- and Sn-rich phases are formed during early cycling, and the damage accumulates as the cycling proceeds. At high temperature, the damage does not accumulates as fast as for the similar strain level in room temperature, due to the lowering of stress level in high temperature and dynamic restructuring of Pb-rich phase.

Copyright © 2002 by ASME
Topics: Alloys , Solders

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