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A Technique for Processing Transient Heat Transfer, Liquid Crystal Experiments in the Presence of Lateral Conduction

[+] Author Affiliations
John C. P. W. Ling, Peter T. Ireland

University of Oxford, Oxford, UK

Lynne Turner

Rolls-Royce Industrial and Marine Gas Turbines, Coventry, UK

Paper No. GT2003-38446, pp. 297-310; 14 pages
doi:10.1115/GT2003-38446
From:
  • ASME Turbo Expo 2003, collocated with the 2003 International Joint Power Generation Conference
  • Volume 5: Turbo Expo 2003, Parts A and B
  • Atlanta, Georgia, USA, June 16–19, 2003
  • Conference Sponsors: International Gas Turbine Institute
  • ISBN: 0-7918-3688-6 | eISBN: 0-7918-3671-1
  • Copyright © 2003 by ASME

abstract

New techniques for processing transient liquid crystal heat transfer experiment have been developed. The methods are able to measure detailed local heat transfer coefficient and adiabatic wall temperature in a three temperature system from a single transient test using the full intensity history recorded. Transient liquid crystal processing methods invariably assume that lateral conduction is negligible and so the heat conduction process can be considered one dimensional into the substrate. However, in regions with high temperature variation such as immediately downstream of a film-cooling hole, it is found that lateral conduction can become significant. For this reason, a procedure which allows for conduction in three dimensions was developed by the authors. The paper is the first report of a means of correcting data from the transient heat transfer liquid crystal experiments for the effects of significant lateral conduction. The technique was applied to a film cooling system as an example and a detailed uncertainty analysis performed.

Copyright © 2003 by ASME

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