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Fabrication of Micro-Actuated Galvanic Cells as Power on Demand for Lab on a Chip Applications by Means of Novel PCB/MEMS Technology

[+] Author Affiliations
A. M. Cardenas-Valencia, D. P. Fries, G. Steimle, H. Broadbent, L. C. Langebrake, R. F. Benson

University of South Florida, St. Petersburg, FL

Paper No. FUELCELL2003-1731, pp. 279-286; 8 pages
  • ASME 2003 1st International Conference on Fuel Cell Science, Engineering and Technology
  • 1st International Fuel Cell Science, Engineering and Technology Conference
  • Rochester, New York, USA, April 21–23, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3668-1
  • Copyright © 2003 by ASME


A novel copper-clad liquid crystal polymer material is proposed as a basic material for the construction of galvanic cells. Copper is an ideal material that allows not only the formation of conductor patterns in the material but also can be electroplated selectively with a wide variety of metals to create heterogeneous systems. The use of a novel mask-less patterning system described herein opens up the opportunity for micro fabrication of different microstructures that can be layered to form complex two and potentially three-dimensional micro fluidic networks. Achieving the photo-imprinting by the use of a novel mask-less system not only reduces the cost but also allows for ease and flexibility in making systems and is ideal for research and development environments. In this paper micro galvanic cells actuated by means of fluidic actuators have been designed and constructed. The electrochemical galvanic cells used as power source examples are a Daniell’s (Copper-Zinc) electrochemical battery, and an aluminum-air galvanic system. The choice for the electrochemical systems is discussed and some preliminary results are presented to show the levels of energy available. In addition, the basic concept of an electrically induced expansion mechanism for circuit activation on demand is described. Lastly, the mechanics of the suggested actuation mechanism are discussed.

Copyright © 2003 by ASME



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