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  • Proceedings Article July 06, 2015

    H. Y. Zhang; Xiao Yan; W. H. Zhu; Leon Lin

    Proc. ASME. 56895; Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001.July 06, 2015
    IPACK2015-48088
    doi: 10.1115/IPACK2015-48088

    TOPICS: Design