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  • Proceedings Article January 01, 2003

    L. Y. Hung; Y. P. Wang; C. S. Hsiao

    Proc. ASME. 36908b; 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2:839-843.January 01, 2003
    IPACK2003-35153
    doi: 10.1115/IPACK2003-35153

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