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Strain Effect on Thermal Transport in Carbon Nanotube-Graphene Junctions

[+] Author Affiliations
Jungkyu Park, Paul Pena

Kennesaw State University, Kennesaw, GA

Paper No. IMECE2018-87764, pp. V08BT10A049; 6 pages
  • ASME 2018 International Mechanical Engineering Congress and Exposition
  • Volume 8B: Heat Transfer and Thermal Engineering
  • Pittsburgh, Pennsylvania, USA, November 9–15, 2018
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5212-5
  • Copyright © 2018 by ASME


We employ molecular dynamics simulations to explore the effect of tensile strain on the thermal conductivity of carbon nanotube (CNT)-graphene junction structures. Two different types of CNT-graphene junctions are simulated; a perfect seamless junction between CNT and graphene with complete sp2 covalent bonds, and a CNT-graphene junction with mixed sp2/sp3 covalent bonds are studied. The most interesting phenomenon observed in the present research study is that the thermal conductivity of CNT-graphene junction structures increases with an increase in mechanical strain. For the case of CNT-graphene junction structure with pillar height of 50 nm and inter-pillar distance of 15 nm, the thermal conductivity is improved by 22.4% when 0.1 tensile strain is imposed. It is observed that the thermal conductivity improvement is enhanced when a larger graphene floor is placed between junctions since larger graphene floor allows larger deformation (larger tensile strain) in the junction. In addition, the thermal conductivity of CNT-graphene junction structures with pure sp2 bonds is observed to be higher than the thermal conductivity of CNT-graphene junction structures with mixed sp2/sp3 bonds regardless of the amount of tensile strain. The obtained results will contribute to the development of flexible electronics by providing a theoretical background on the thermal transport of three dimensional carbon nanostructures under deformation.

Copyright © 2018 by ASME



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