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Development of an Automated Flexible Micro-Soldering Station

[+] Author Affiliations
Vinoth Venkatesan, David J. Cappelleri

Purdue University, West Lafayette, IN

Paper No. DETC2017-68107, pp. V004T09A023; 9 pages
  • ASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
  • Volume 4: 22nd Design for Manufacturing and the Life Cycle Conference; 11th International Conference on Micro- and Nanosystems
  • Cleveland, Ohio, USA, August 6–9, 2017
  • Conference Sponsors: Design Engineering Division, Computers and Information in Engineering Division
  • ISBN: 978-0-7918-5816-5
  • Copyright © 2017 by ASME


This paper describes a flexible automated soldering system to handle meso and micro-scale soldering operations. The system is guided by a vision system and consists of two micromanipulators, an XY motion stage, and a solder pen with an automatic solder feeder. One micromanipulator is used to hold and position the solder pen and attached solder feeder in the workspace; the second micromanipulator is used to hold and position the wire(s) to be soldered on to a printed circuit board (PCB). After hardware and vision system calibration, the user can select point(s) from a real-time image of the workspace for the desired soldering operations to occur. The soldering process is then carried out automatically two different ways: 1. By servoing the XY motion stage with the PCB to position it under the soldering manipulator followed by the solder operation; or 2. By moving the soldering manipulator to the target soldering sites on the PCB that remain stationary. Experimental results for both scenarios are presented and discussed for soldering single and multiple wires at a time. This system provides a flexible manufacturing solution for operations that demand custom micro-soldering operations in a 2D plane.

Copyright © 2017 by ASME
Topics: Soldering



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