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Thermal Metamaterials for Heat Flow Control in Electronics

[+] Author Affiliations
Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

Toyota Research Institute of North America, Ann Arbor, MI

Paper No. IPACK2017-74112, pp. V001T04A006; 10 pages
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • San Francisco, California, USA, August 29–September 1, 2017
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5809-7
  • Copyright © 2017 by ASME


Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here, the field of thermal metamaterials as it applies to electronics is briefly reviewed. Recent research and development of thermal meta-material systems with anisotropic thermal conductivity for the manipulation of heat flow in ultra-thin composites is explained. An explanation of fundamental experimental studies on heat flow control using standard printed circuit board technology follows. From this, basic building blocks for heat flux cloaking, focusing, and reversal are reviewed, and their extension to a variety of electronics applications is emphasized. While device temperature control, thermal energy harvesting, and electro-thermal circuit design are the primary focus, some discussion on the extension of thermal-guiding structures to device-scale applications is provided. In total, a holistic view is offered of the myriad of possible applications of thermal metamaterials to heat flow control in future electronics.

Copyright © 2017 by ASME



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