0

Full Content is available to subscribers

Subscribe/Learn More  >

Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions

[+] Author Affiliations
Emad A. Poshtan, Andreas Roessle

Robert Bosch Company, Reutlingen, Germany

Sudarshan Hegde

Robert Bosch Engineering and Business Solutions Pvt. Ltd, Bangalore, India

Paper No. IPACK2017-74021, pp. V001T02A016; 6 pages
doi:10.1115/IPACK2017-74021
From:
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • San Francisco, California, USA, August 29–September 1, 2017
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5809-7
  • Copyright © 2017 by ASME

abstract

The miniaturization of Control Units (CUs), consequently increasing power and reduced component size justifies a growing need for significantly improved Thermal Interface Material (TIM) which is a pivotal material for transferring heat from a die to a heat-spreader. However, it also has a crucial effect on the thermomechanical and dynamic behavior of the attached components. In this paper, the effect of frequency dependency of TIM on dynamic behavior of the attached capacitor is investigated analytically, numerically and experimentally. The results show that it is crucial to consider the frequency dependent material properties of TIM, for reliability assessment of the attached components under dynamic loading conditions.

Copyright © 2017 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In