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Advanced Cooling of 3D ICs With Nanoparticle Packings

[+] Author Affiliations
Anil Yuksel, Paul S. Ho

University of Texas at Austin, Austin, TX

Jayathi Murthy

University of California, Los Angeles, Los Angeles, CA

Paper No. IPACK2017-74137, pp. V001T01A025; 4 pages
doi:10.1115/IPACK2017-74137
From:
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • San Francisco, California, USA, August 29–September 1, 2017
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5809-7
  • Copyright © 2017 by ASME

abstract

Thermal-aware techniques for 3D ICs have shown that high temperatures dramatically reduce the lifetime and the reliability of the 3D ICs with utilizing the third dimension. Hence, thermal management has been very crucial for the further improvement of the 3D IC architecture. There has been some thermal management strategies suggested at the micro/nano scale to alleviate the nonlocal heat dissipation; however, many solution methods such as liquid cooling have challenges and create many problems. In this paper, we propose nanoparticle based interfacial cooling to improve the thermal transport due to surface phonon polariton coupling and to reduce the thermal resistance between the interfaces. We demonstrate the efficiency of the heat dissipation from the proposed structure for 3D ICs.

Copyright © 2017 by ASME

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