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Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

[+] Author Affiliations
Takahiro Kinoshita, Takashi Kawakami

Toyama Prefectural University, Imizu, Japan

Tadaharu Adachi, Masahiro Funaki

Toyohashi University of Technology, Toyohashi, Japan

Paper No. IPACK2017-74099, pp. V001T01A014; 4 pages
doi:10.1115/IPACK2017-74099
From:
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • San Francisco, California, USA, August 29–September 1, 2017
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5809-7
  • Copyright © 2017 by ASME

abstract

In this study, dynamic three points bending test by split Hopkinson pressure bar method and numerical simulations which was based on finite element method (FEM) were performed to estimate stress-based design standard for 3216 type of multilayer ceramic capacitors (MLCCs). Tool for creating the standard was suggested and linear dependence with loading rate was shown in the standard.

Copyright © 2017 by ASME

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