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Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

[+] Author Affiliations
Hyoungsoon Lee

Chung-Ang University, Seoul, South Korea

Tanmoy Maitra

University College London, London, UK

James Palko, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson

Stanford University, Stanford, CA

Michael Barako

Northrop Grumman Aerospace Systems, Redondo Beach, CA

Yoonjin Won

University of California, Irvine, Irvine, CA

Paper No. IPACK2017-74090, pp. V001T01A006; 6 pages
doi:10.1115/IPACK2017-74090
From:
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • San Francisco, California, USA, August 29–September 1, 2017
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5809-7
  • Copyright © 2017 by ASME

abstract

Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance pool boiling performance using a thin CIO film with a thickness of ∼ 10 μm and pore diameter of 5 μm. The microfabricated CIO film increases microscale surface roughness that in turn leads to more active nucleation sites thus improved boiling performance parameters such as heat transfer coefficient and critical heat flux compared to those of smooth Si surfaces. The experimental results for CIO film show a maximum critical heat flux of 225 W/cm2 (at 16.2°C superheat) or about 3 times higher than that of smooth Si surface (80 W/cm2 at 21.6°C superheat). Optical images showing bubble formation on the microporous copper surface are captured to provide detailed information of bubble departure diameter and frequency.

Copyright © 2017 by ASME

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