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Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications

[+] Author Affiliations
Siavash Ghanbari, Jeff Darabi

Southern Illinois University Edwardsville, Edwardsville, IL

Paper No. HT2017-4935, pp. V001T08A008; 6 pages
  • ASME 2017 Heat Transfer Summer Conference
  • Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems
  • Bellevue, Washington, USA, July 9–12, 2017
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-5788-5
  • Copyright © 2017 by ASME


This paper presents an experimental investigation to study the thermal and material characterization of an array of composite copper-carbon nanotubes (CNT) micropillars for applications in passive two-phase cooling systems. These novel micropillar structures have a larger spacing at the base of the micropillars to provide a higher liquid permeability and mushroom-like structures on the top surface of the micropillars with a smaller spacing to provide a greater capillary pressure. First, composite copper-CNT micropillars are fabricated by an electrodeposition method on a patterned copper template. Then, cauliflower-like nanostructures are grown on the top surface of the micropillars using chronoamperometry technique to improve the capillary pressure and thermal performance of the micropillars. Finally, a series of tests are conducted to quantify the thermal performance of the fabricated micropillars. The results indicate that the performance of mushroom-like composite copper-CNT micropillars is significantly higher than those of copper micropillar arrays.

Copyright © 2017 by ASME



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