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Thermal Performance of Asymmetrical Saw-Toothed Microchannels With Phase Change

[+] Author Affiliations
Le Gao, James M. Pool, Sushil H. Bhavnani

Auburn University, Auburn, AL

Paper No. IMECE2016-66240, pp. V008T10A092; 7 pages
doi:10.1115/IMECE2016-66240
From:
  • ASME 2016 International Mechanical Engineering Congress and Exposition
  • Volume 8: Heat Transfer and Thermal Engineering
  • Phoenix, Arizona, USA, November 11–17, 2016
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5062-6
  • Copyright © 2016 by ASME

abstract

Modern-day microprocessors consist of over one billion integrated circuits on silicon chips as small as a human fingernail. Normal operation of this circuitry produces an enormous amount of heat on a very small footprint. Dissipating this heat is a very challenging task, perhaps the largest roadblock to continued increases in computing technology. Microchannel heat sinks utilizing either single-phase flow or phase-change are an effective means of cooling stacked 3-D microelectronics. A roadblock to practical implementation of microchannels is the presence of flow instabilities. The asymmetric saw-toothed microchannel heat sink is proposed to address this issue. Deep reactive-ion etching is used to produce channels comprised of asymmetric sawtoothed structures that alter the local flow structure within the microchannel. All experiments are conducted using the dielectric fluid, FC-72. Each microchannel array has a footprint of 1 cm × 1 cm, comprised of thirty-four channels etched into a silicon wafer. A series of thin film serpentine copper heaters is fabricated on the other side of the silicon wafer to provide a uniform heat flux boundary condition. Experimental information is presented for a range of mass fluxes from 381 to 1777 kg/m2s, and inlet subcooling from 5°C to 20°C. Parameters presented and analyzed includes boiling curves, onset of boiling (ONB), averaged two-phase heat transfer coefficient.

Copyright © 2016 by ASME
Topics: Microchannels

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