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Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems.

[+] Author Affiliations
Danny J. Lohan, James T. Allison

University of Illinois at Urbana-Champaign, Urbana, IL

Ercan M. Dede, Masanori Ishigaki

Toyota Research Institute of North America, Ann Arbor, MI

Paper No. DETC2016-60218, pp. V02BT03A013; 10 pages
doi:10.1115/DETC2016-60218
From:
  • ASME 2016 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
  • Volume 2B: 42nd Design Automation Conference
  • Charlotte, North Carolina, USA, August 21–24, 2016
  • Conference Sponsors: Design Engineering Division, Computers and Information in Engineering Division
  • ISBN: 978-0-7918-5011-4
  • Copyright © 2016 by ASME

abstract

In this article we explore a coupled design strategy for the simultaneous optimization of lumped-parameter (electrical) and continuum parameter (thermal) systems. In terms of electrical circuit response, advances in the development of wide band-gap semiconductors and the high speed transient behavior of these devices leads to challenges associated with damping or over-shoot. To address such issues, traditional circuit design strategies should evolve to incorporate next generation electrical components effectively. Thus, we propose the incorporated design of circuit layout and routing in conjunction with heat spreader design as a more comprehensive means to optimize the layout of power-dense electronics. The effects of this multidisciplinary design are evaluated by analyzing the Pareto set, which was observed to shift towards the utopia point with each additional design consideration.

Copyright © 2016 by ASME
Topics: Design , Optimization

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