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Thermal Interfacial Resistance Reduction Between Metal and Dielectric Materials by Inserting Intermediate Metal Layer

[+] Author Affiliations
Xiangyu Li, Wonjun Park, Yong P. Chen, Xiulin Ruan

Purdue University, West Lafayette, IN

Paper No. HT2016-7414, pp. V001T04A006; 6 pages
  • ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems
  • Washington, DC, USA, July 10–14, 2016
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-5032-9
  • Copyright © 2016 by ASME


In this work, we have observed 60% reduction in total interfacial resistance by adding an intermediate metal layer nickel between gold and aluminum oxide. Two temperature model is applied to explain the change of interfacial resistance, including both lattice mismatch with diffuse mismatch model and electron-phonon coupling effect. Simulation result agrees reasonably well with experimental data. Even though interfacial resistance due to electron-phonon coupling effect for Au-aluminum oxide is much larger than that of Ni-aluminum oxide interface, lattice mismatch is still the dominant factor for interfacial resistance.

Copyright © 2016 by ASME



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