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A Mie-Metamaterial Based Thermal Emitter for TPV Applications

[+] Author Affiliations
Alok Ghanekar, Yi Zheng

University of Rhode Island, Kingston, RI

Paper No. HT2016-7123, pp. V001T03A009; 7 pages
  • ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems
  • Washington, DC, USA, July 10–14, 2016
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-5032-9
  • Copyright © 2016 by ASME


We theoretically demonstrate a novel, efficient and cost effective thermal emitter using a Mie-resonance metamaterial for thermophotovoltaic (TPV) applications. We propose for the first time the design of a thermal emitter which is based on nanoparticle-embedded thin film. The emitter consists of a thin film of SiO2 on the top of tungsten layer deposited on a substrate. The thin film is embedded with tungsten nanoparticles which alter the refractive index of the film. This gives rise to desired emissive properties in the wavelength range of 0.4 μm to 2 μm suitable for GaSb and InGaAs based photovoltaics. Effective dielectric properties are calculated using Maxwell-Garnett-Mie theory. Our calculations indicate this would significantly improve the efficiency of TPV cells. We introduce a new parameter to gauge the efficacy of thermal emitters and use it to compare different designs.

Copyright © 2016 by ASME
Topics: Metamaterials



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