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Heat Dissipation Beyond 1 kW/cm2 With Low Pressure Drop and High Heat Transfer Coefficient for Flow Boiling Using Open Microchannels With Tapered Manifold

[+] Author Affiliations
Ankit Kalani, Satish G. Kandlikar

Rochester Institute of Technology, Rochester, NY

Paper No. ICNMM2016-7918, pp. V001T03A001; 5 pages
doi:10.1115/ICNMM2016-7918
From:
  • ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2016 Heat Transfer Summer Conference and the ASME 2016 Fluids Engineering Division Summer Meeting
  • ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels
  • Washington, DC, USA, July 10–14, 2016
  • Conference Sponsors: Fluids Engineering Division
  • ISBN: 978-0-7918-5034-3
  • Copyright © 2016 by ASME

abstract

Heat dissipation beyond 1 kW/cm2 accompanied with high heat transfer coefficient and low pressure drop using water has been a long-standing goal in the flow boiling research directed toward electronic cooling application. In the present work, three approaches are combined to reach this goal: (a) a microchannel with a manifold to increase critical heat flux (CHF) and heat transfer coefficient (HTC), (b) a tapered manifold to reduce the pressure drop, and (c) high flow rates for further enhancing CHF from liquid inertia forces. A CHF of 1.07 kW/cm2 was achieved with a heat transfer coefficient of 295 kW/m2°C with a pressure drop of 30 kPa. Effect of flow rate on CHF and HTC is investigated. High speed visualization to understand the underlying bubble dynamics responsible for low pressure drop and high CHF is also presented.

Copyright © 2016 by ASME

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