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Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

[+] Author Affiliations
Pradeep Lall, Di Zhang, Jeff Suhling

Auburn University, Auburn, AL

David Locker

US ARMY AMRDEC, Huntsville, AL

Paper No. IMECE2015-53751, pp. V010T13A023; 11 pages
doi:10.1115/IMECE2015-53751
From:
  • ASME 2015 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro- and Nano-Systems Engineering and Packaging
  • Houston, Texas, USA, November 13–19, 2015
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5753-3
  • Copyright © 2015 by ASME

abstract

Portable products such as smartphones and tablets stay in the powered on condition for a majority of their operational life during which time the device internals are maintained at higher than ambient temperature. Thus, it would be expected for interconnects in portable products to be at a temperature high than room temperature when subjected to accidental drop or shock. Furthermore, electronics in missile-applications may be subjected to high strain rates after prolonged period of storage often at high temperature. Electronics systems including interconnects may experience high strain rates in the neighborhood of 1–100 per sec during operation at high temperature. However, the material properties of SAC305 leadfree solders at high strain rates and high operating temperatures are scarce after long-term storage. Furthermore, the solder interconnects in simulation of product drop are often modeled using elastic-plastic properties or linear elastic properties, neither of which accommodate the effect of operating temperature on the solder interconnect deformation at high operating temperature. SAC305 solders have been shown to demonstrate the significant degradation of mechanical properties including the tensile strength and the elastic modulus after exposure to high temperature storage for moderate periods of time. Previously, Anand’s viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components under thermo-mechanical deformation. Uniaxial stress-strain curves have been plotted over a wide range of strain rates (ε̇ = 10, 35, 50, 75 /sec) and temperatures (T = 25, 50, 75, 100, 125°C). Anand viscoplasticity constants have been calculated by non-linear fitting procedures. In addition, the accuracy of the extracted Anand constants has been evaluated by comparing the model prediction and experimental data.

Copyright © 2015 by ASME

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