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Toward Material Parameters for Modeling Devices Made From an Epoxy-Based Shape Memory Polymer

[+] Author Affiliations
Veysel Erel, Jessica L. Berry, Arun Srinivasa, Terry S. Creasy

Texas A&M University, College Station, TX

Paper No. SMASIS2015-9043, pp. V001T01A018; 7 pages
doi:10.1115/SMASIS2015-9043
From:
  • ASME 2015 Conference on Smart Materials, Adaptive Structures and Intelligent Systems
  • Volume 1: Development and Characterization of Multifunctional Materials; Mechanics and Behavior of Active Materials; Modeling, Simulation and Control of Adaptive Systems
  • Colorado Springs, Colorado, USA, September 21–23, 2015
  • Conference Sponsors: Aerospace Division
  • ISBN: 978-0-7918-5729-8
  • Copyright © 2015 by ASME

abstract

Designing devices made from epoxy-based shape memory polymers is difficult because few material behavior parameters are available for these materials in the rubbery/shape changing region. This work examines the rubbery state, greater than 20° C above the glass transition temperature (Tg), as an elastomeric regime suited to characterization with simple tension and planar tension experiments. Differential scanning calorimetry (DSC) results show a 70° C Tg, which agrees with prior research. Simple tension experiments at 100° C exhibited nonlinear elastic behavior, and finite element analysis (FEA) agreed with the constitutive behavior exhibited in the experiments. Planar tension experiments exhibited novel results. The stress/strain response was sigmoidal with a significant plateau in stress followed by rising stress to failure. The typical 10:1 gage width/gage length ratio seemed to over constrain the material. The strain to failure is small, and suggests the material behavior is a hybrid of elastic and hyperelastic behavior.

Copyright © 2015 by ASME

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