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Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications

[+] Author Affiliations
Chi Zhang, James W. Palko, Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson

Stanford University, Stanford, CA

Guoguang Rong

Shanghai Jiao Tong University, Shanghai, China

Thomas J. Dusseault

General Electric Global Research, Niskayuna, NY

Paper No. IPACK2015-48262, pp. V002T06A004; 6 pages
  • ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
  • Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
  • San Francisco, California, USA, July 6–9, 2015
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5689-5
  • Copyright © 2015 by ASME


Microporous metals are extensively applied in convective cooling of high heat flux systems such as electronics. Traditional fabrication approaches, such as sintering of metallic particles, however, produce materials with limited fluid transport capability. Here, we demonstrate control and enhancement of the permeability of porous copper inverse opals produced via electrodeposition around a sacrificial polymer template. Sintering of the template is used to control the fluid transport network microstructure, with permeability increasing for increasing sintering times. These electrodeposited structures achieve permeabilities greater than 1×10−12 m2 with 5 μm pores, roughly 5 times larger than those of porous sintered copper with comparable feature sizes. The high permeability and small feature sizes, with attendant high specific surface area and strong capillarity, offered by the sintered template electrodeposited copper are attractive for two phase cooling applications.

Copyright © 2015 by ASME



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