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Highly Stretchable Interconnects for Flexible Electronics Applications

[+] Author Affiliations
Yeasir Arafat, Rahul Panat, Indranath Dutta

Washington State University, Pullman, WA

Paper No. IPACK2015-48130, pp. V002T02A029; 5 pages
doi:10.1115/IPACK2015-48130
From:
  • ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
  • Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
  • San Francisco, California, USA, July 6–9, 2015
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5689-5
  • Copyright © 2015 by ASME

abstract

Interconnects that can deform under monotonous and/or repeated loading are increasingly important to a new class of electronic devices used for wearable applications. Such interconnects integrate different material sets such as polymers and metallic conductors and are subjected to large strain levels. A typical method to overcome the material incompatibility involves the conductor in the form of a serpentine or an out-of-the plane buckled geometry. In this paper, we demonstrate a novel combination of interconnect materials that enables significant improvement in the interconnect stretchability using Indium over the state-of-the-art without affecting the system performance. This was achieved without the necessity of the serpentine interconnects geometry that significantly improves the routing density. The manufacturing method used for this approach is also described. Finally, we discuss the cost competitiveness of the materials and the manufacturing method to assess the commercial viability of this approach. (5nm)

Copyright © 2015 by ASME

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