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Microstructure Evolution and Bond Formation at the Contact Interface During Ultrasonic Consolidation Process

[+] Author Affiliations
Song Zhang, Lili Zheng, Hui Zhang

Tsinghua University, Beijing, China

Paper No. IMECE2014-37203, pp. V014T11A004; 8 pages
  • ASME 2014 International Mechanical Engineering Congress and Exposition
  • Volume 14: Emerging Technologies; Engineering Management, Safety, Ethics, Society, and Education; Materials: Genetics to Structures
  • Montreal, Quebec, Canada, November 14–20, 2014
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4963-7
  • Copyright © 2014 by ASME


In this paper a cellular automata-finite elements (CAFE) model is developed by combining traditional finite elements (FE) model and cellular automata (CA) model. The microstructure under different process conditions of ultrasonic consolidation (UC) process for Al 7075 is studied. It is found that higher energy input process conditions (higher applied load and sonotrode oscillation amplitude, lower sonotrode travel speed) will lead to a higher value of dynamic recrystallization (DRX) fraction for UC deposited foils. The mean dislocation density of the UC deposited material will increase with the applied load while it decreases with the increase of sonotrode travel speed and oscillation amplitude.

Copyright © 2014 by ASME



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