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Nucleate Boiling of Dielectric Liquids on Hydrophobic Patterned Surfaces

[+] Author Affiliations
Nihal E. Joshua, Denesh K. Ajakumar, Huseyin Bostanci

University of North Texas, Denton, TX

Paper No. IMECE2014-37513, pp. V08BT10A061; 6 pages
  • ASME 2014 International Mechanical Engineering Congress and Exposition
  • Volume 8B: Heat Transfer and Thermal Engineering
  • Montreal, Quebec, Canada, November 14–20, 2014
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4956-9
  • Copyright © 2014 by ASME


This study experimentally investigated the effect of hydrophobic patterned surfaces in nucleate boiling heat transfer. A dielectric liquid, HFE-7100, was used as the working fluid in the saturated boiling tests. Dielectric liquids are known to have highly-wetting characteristics. They tend to fill surface cavities that would normally trap vapor/gas, and serve as active nucleation sites during boiling. With the lack of these vapor filled cavities, boiling of a dielectric liquid leads to high incipience superheats and accompanying temperature overshoots. Heater samples in this study were prepared by applying a thin Teflon (AF400, Dupont) coating on 1-cm2 smooth copper surfaces following common photolithography techniques. Matching size thick film resistors, attached onto the copper samples, generated heat and simulated high heat flux electronic devices. Tests investigated the heater samples featuring circular pattern sizes between 40–100 μm, and corresponding pitch sizes between 80–200 μm. Additionally, a plain, smooth copper surface was tested to obtain reference data. Based on data, hydrophobic patterned surfaces effectively eliminated the temperature overshoot at boiling incipience, and considerably improved nucleate boiling performance in terms of heat transfer coefficient and critical heat flux over the reference surface. Hydrophobic patterned surfaces therefore demonstrated a practical surface modification method for heat transfer enhancement in immersion cooling applications.

Copyright © 2014 by ASME



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