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Fatigue Test for Thick Wire Bonds

[+] Author Affiliations
Turker Dagdelen, Karim El-Rayes, Sangtak Park, Mahmoud Khater, Resul Saritas, Eihab Abdel-Rahman, Mustafa Yavuz

University of Waterloo, Waterloo, ON, Canada

Paper No. DETC2014-35190, pp. V008T11A010; 4 pages
  • ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
  • Volume 8: 26th Conference on Mechanical Vibration and Noise
  • Buffalo, New York, USA, August 17–20, 2014
  • Conference Sponsors: Design Engineering Division, Computers and Information in Engineering Division
  • ISBN: 978-0-7918-4641-4
  • Copyright © 2014 by ASME


Thick bonding wires used in power modules experience a wide range of temperature and mechanical load cycling conditions. This leads to cracks at the wire heel due to fatigue. In this study, a new type of thick wire bonds, Aluminum coated copper, was subjected to fatigue test to investigate its durability. Unlike traditional thermal cycling, this test involves applying a pattern of repetitive prescribed displacements to a wire foot while fatigue failure is detected via a Wheatstone bridge. The aim is to compare different wire materials to the number-of-cycles-to-failure, thereby quantifying the reliability and life time of thick wire bond.

Copyright © 2014 by ASME
Topics: Wire , Fatigue testing



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