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“Pain Index Survey” for Flipped Classroom in Design Education

[+] Author Affiliations
Ang Liu, Stephen C.-Y. Lu

University of Southern California, Los Angeles, CA

Yun Dai

University of California, Santa Barbara, Santa Barbara, CA

Paper No. DETC2014-35112, pp. V003T04A019; 4 pages
doi:10.1115/DETC2014-35112
From:
  • ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
  • Volume 3: 16th International Conference on Advanced Vehicle Technologies; 11th International Conference on Design Education; 7th Frontiers in Biomedical Devices
  • Buffalo, New York, USA, August 17–20, 2014
  • Conference Sponsors: Design Engineering Division, Computers and Information in Engineering Division
  • ISBN: 978-0-7918-4634-6
  • Copyright © 2014 by ASME

abstract

The purpose of the flipped classroom approach is to enhance the effectiveness of interactions in class. Nevertheless, in practice, simply asking students to watch lecture recordings at home will not automatically lead to more structured interactions in class. To address this challenge, this paper introduces a new method called the pain index survey, which functions to collect, aggregate, and analyze student’s early feedback in terms of how painful they feel over each content slide during their before-class learning. The accumulated pain index survey result can facilitate the teaching/learning of design in two ways. First, different students’ common feedbacks will enable the instructor to identify those universally perceived learning difficulties and to address them accordingly via guided instructor-student interactions in class. Second, different students’ complementary feedbacks will facilitate the instructor to form study groups respectively to promote the peer-to-peer interactions after class. Two case studies are presented to share some of our preliminary lessons and observations.

Copyright © 2014 by ASME

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