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Ultrasonic Spectroscopy for Simulated Plastic IC Packages FREE

[+] Author Affiliations
Narayan R. Joshi

Prairie View A & M University, Prairie View, TX

Paper No. 97-AA-064, pp. V001T13A040; 6 pages
doi:10.1115/97-AA-064
From:
  • ASME 1997 Turbo Asia Conference
  • ASME 1997 Turbo Asia Conference
  • Singapore, September 30–October 2, 1997
  • Conference Sponsors: International Gas Turbine Institute
  • ISBN: 978-0-7918-7867-5
  • Copyright © 1997 by ASME

abstract

Failure analysis of integrated circuit (IC) packages is a critical element for in house quality control and for problems encountered in service. Plastic IC packages are routinely inspected for delaminations, voids, cracks, and corrosion using the C-mode acoustic microscopy (C-AM). Plastic IC packages are hygroscopic and can absorb moisture subjected to environmental cycling depending on the quality of the plastic chemical compound used to encapsulate the IC chip. The new advanced ultrasonic interference spectroscopy (UIS) technique used by the author elsewhere to detect presence of moisture in adhesively bonded joints is applied to the problems of the plastic IC packages in this research work. The new UIS technique was used on manually fabricated simulated plastic packages with thin water film trapped between two layers of plastic material (Lexan) and the silicon wafer. The technique successfully detected the presence of an extra water layer in the assembly inspected and estimated its thickness accurately to be 110 μm. At present the technique is under development for detection of water films thinner than 110 μm in actual plastic IC packages.

Copyright © 1997 by ASME
Topics: Spectroscopy
This article is only available in the PDF format.

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