Ultrasonic Spectroscopy for Simulated Plastic IC Packages PUBLIC ACCESS

[+] Author Affiliations
Narayan R. Joshi

Prairie View A & M University, Prairie View, TX

Paper No. 97-AA-064, pp. V001T13A040; 6 pages
  • ASME 1997 Turbo Asia Conference
  • ASME 1997 Turbo Asia Conference
  • Singapore, September 30–October 2, 1997
  • Conference Sponsors: International Gas Turbine Institute
  • ISBN: 978-0-7918-7867-5
  • Copyright © 1997 by ASME


Failure analysis of integrated circuit (IC) packages is a critical element for in house quality control and for problems encountered in service. Plastic IC packages are routinely inspected for delaminations, voids, cracks, and corrosion using the C-mode acoustic microscopy (C-AM). Plastic IC packages are hygroscopic and can absorb moisture subjected to environmental cycling depending on the quality of the plastic chemical compound used to encapsulate the IC chip. The new advanced ultrasonic interference spectroscopy (UIS) technique used by the author elsewhere to detect presence of moisture in adhesively bonded joints is applied to the problems of the plastic IC packages in this research work. The new UIS technique was used on manually fabricated simulated plastic packages with thin water film trapped between two layers of plastic material (Lexan) and the silicon wafer. The technique successfully detected the presence of an extra water layer in the assembly inspected and estimated its thickness accurately to be 110 μm. At present the technique is under development for detection of water films thinner than 110 μm in actual plastic IC packages.

Copyright © 1997 by ASME
Topics: Spectroscopy
This article is only available in the PDF format.



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In