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Electrical Interconnect and Microfluidic Cooling Within 3D ICs and Silicon Interposer

[+] Author Affiliations
Hanju Oh, Yue Zhang, Li Zheng, Muhannad S. Bakir

Georgia Institute of Technology, Atlanta, GA

Paper No. ICNMM2014-21813, pp. V001T05A005; 7 pages
doi:10.1115/ICNMM2014-21813
From:
  • ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting
  • ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels
  • Chicago, Illinois, USA, August 3–7, 2014
  • Conference Sponsors: Fluids Engineering Division
  • ISBN: 978-0-7918-4627-8
  • Copyright © 2014 by ASME

abstract

Heat dissipation is a significant challenge for three-dimensional integrated circuits (3D IC) due to the lack of heat removal paths and increased power density. In this paper, a 3D IC system with an embedded microfluidic cooling heat sink (MFHS) is presented. In the proposed 3D IC system, high power tiers contain embedded MFHS and high-aspect ratio (23:1) through-silicon-vias (TSVs) routed through the integrated MFHS. In addition, each tier has dedicated solder-based microfluidic chip I/Os. Microfluidic cooling experiments of staggered micropin-fins with embedded TSVs are presented for the first time. Moreover, the lateral thermal gradient across a chip is analyzed with segmented heaters.

Copyright © 2014 by ASME

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