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A CFD Study on Film Thickness, Pressure Drop, and Heat Transfer of Slug Flows in Circular Microchannels

[+] Author Affiliations
Vandad Talimi, Yuri S. Muzychka, Serpil Kocabiyik

Memorial University of Newfoundland, St. John’s, NL, Canada

Paper No. ICNMM2014-21382, pp. V001T03A005; 11 pages
doi:10.1115/ICNMM2014-21382
From:
  • ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting
  • ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels
  • Chicago, Illinois, USA, August 3–7, 2014
  • Conference Sponsors: Fluids Engineering Division
  • ISBN: 978-0-7918-4627-8
  • Copyright © 2014 by ASME

abstract

Slug flows in microchannels have been studied in the past two decades as a method to enhance heat transfer. Several correlations have been developed for predicting film thickness, pressure drop, and heat transfer, mostly based on experimental analysis. More recently, numerical simulation become an available tool providing deeper insight of these flows. In the present study, a number of numerical simulations of slug flows performed under different wall thermal conditions, the results have been compared to the available correlations, and gaps in existing models have been highlighted. The simulations have been carried out using the commercial package ANSYS Fluent. Film thickness, pressure drop, and heat transfer models under constant wall heat flux and constant temperature have been focused, and finally suggestion for future studies have been presented.

Copyright © 2014 by ASME

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