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Preparation of Elastic Bipolar Plate for Polymer Electrolyte Fuel Cells

[+] Author Affiliations
Jae-Young Lee, Bumchoul Choi, Woo-Kum Lee, Hong-Ki Lee

Woosuk University, Bongdong, Chonbuk, Korea

Joong-Pyo Shim

Kunsan National University, Kunsan, Jeonbuk, Korea

Paper No. IMECE2013-63579, pp. V015T16A011; 8 pages
  • ASME 2013 International Mechanical Engineering Congress and Exposition
  • Volume 15: Safety, Reliability and Risk; Virtual Podium (Posters)
  • San Diego, California, USA, November 15–21, 2013
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5644-4
  • Copyright © 2013 by ASME


Highly conductive bipolar plate for polymer electrolyte membrane fuel cell (PEMFC) was prepared using phenol novolac-type epoxy/graphite powder (GP)/carbon fiber filament (CFF) composite, and a rubber-modified epoxy resin was introduced to the phenol novolac-type epoxy resin in order to give elasticity to the bipolar plate. The cure condition of the neat epoxy system, differential scanning calorimetry (DSC) was carried out and the DSC data were introduced to Kissinger equation. And tensile and flexural tests were carried out using universal testing machine (UTM) and the surface morphology of the fractured specimen and the interfacial bonding between epoxy matrix and CFF were observed by a scanning electron microscopy (SEM). Kissinger expression showed that the activation energy for the cure kinetics of novolac epoxy (9.3g)/rubber epoxy (1.0g)/curing agent (9.6g)/accelerator (0.1g) system was 76.8 kJ/mol and the pre-exponential factor was 1.73 × 1010 min−1. As was expected, electrical conductivity increased with increasing total carbon content, and the value increased with increasing CFF content at the same carbon content. Tensile strength and flexural strength linearly decreased with increasing epoxy content, however at the same carbon content, these values increased with increasing CFF content. It was because the CFF acted as electrical conductive pass and the good effect on the mechanical properties was due to the strong bonding between CFF and epoxy resin, which was confirmed by the SEM.

Copyright © 2013 by ASME



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