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Dimensionless Optimization of Thermoelectric Cooler Performance When Integrated Within a Thermal Resistance Network

[+] Author Affiliations
Matthew R. Pearson, Charles E. Lents

United Technologies Research Center, East Hartford, CT

Paper No. IMECE2013-65940, pp. V010T11A087; 13 pages
doi:10.1115/IMECE2013-65940
From:
  • ASME 2013 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro- and Nano-Systems Engineering and Packaging
  • San Diego, California, USA, November 15–21, 2013
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5639-0
  • Copyright © 2013 by United Technologies Corporation

abstract

Thermoelectric coolers are solid-state cooling devices which, in certain applications, can be used to reduce the operating temperature of electronics or increase their heat dissipation. However, the performance of the cooler is strongly influenced by the thermal system into which it is placed, and the cooler design should be optimized for a given system. In this work, the possible benefits of a thermoelectric cooler implemented within a realistic thermal system are quantified. Finite thermal conductances between the cooled device and the thermoelectric cooler, and between the thermoelectric cooler and the heat sink are considered. The entire problem is treated using dimensionless parameters, which reduces the number of independent parameters and enables generalized performance maps which clearly show the maximum benefit (in terms of a reduced device temperature or increased device heat dissipation) that a prescribed thermoelectric cooler can deliver to a particular application. The use of these dimensionless parameters also allows for optimization of thermoelectric cooler parameters without considering the cooler detailed design geometry.

Copyright © 2013 by United Technologies Corporation

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