0

Full Content is available to subscribers

Subscribe/Learn More  >

Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability

[+] Author Affiliations
Sathyanarayanan Raghavan, Suresh Sitaraman

Georgia Institute of Technology, Atlanta, GA

Ilko Schmadlak

Freescale Semiconductor, Munich, Germany

George Leal

Freescale Semiconductor, Austin, TX

Paper No. IMECE2013-65877, pp. V010T11A074; 6 pages
doi:10.1115/IMECE2013-65877
From:
  • ASME 2013 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro- and Nano-Systems Engineering and Packaging
  • San Diego, California, USA, November 15–21, 2013
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5639-0
  • Copyright © 2013 by ASME

abstract

Large-scale integration at lower cost has led to the usage of multi-layered organic substrates in flip-chip assemblies. However, the warpage of substrate plays an important role in the reliability of back-end-of-line (BEOL) stack on a chip. In this work, we study the effect of substrate layer configuration, and thus the warpage of the substrate at reflow temperature on BEOL reliability. A plane-strain flip-chip on substrate assembly model is utilized to study the die and solder stresses for different substrate layer configurations. Apart from studying the die stresses, fracture mechanics based approach is used to study the effect of substrate configuration on energy available for a crack present in back-end-of-line (BEOL) stack. In this paper, we describe the methodology to model the substrate with initial warpage at reflow temperature, characterize the effect of the initial warpage at reflow temperature on die stresses at room temperature and further use fracture mechanics based approach to predict the change in risk for a crack present in BEOL stack for different substrate warpage configurations at reflow temperature.

Copyright © 2013 by ASME
Topics: Reliability , Warping , Design

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In