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Micro-Scale Thermal Sensor Manufacturing and Measurement of Temperature Uniformity on Wafer Surface

[+] Author Affiliations
Jun Young Kim, Kyung Min Jang, Hong Cheon Yang, Kwang-Sun Kim

Korea University of Technology and Education, Cheonan, Chungnam, Korea

Paper No. IMECE2013-65537, pp. V010T11A070; 10 pages
  • ASME 2013 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro- and Nano-Systems Engineering and Packaging
  • San Diego, California, USA, November 15–21, 2013
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5639-0
  • Copyright © 2013 by ASME


In this research, uniformity of temperature on wafer in fine scale was investigated. A measurement system has been developed, and a sensor as thin-film thermocouple was fabricated using a lift-off process. To generate EMF voltage by Seebeck effect, Chromel and Alumel materials were used for the thermocouple. The system obtains the micro scale temperature from multi-points on the surface of the wafer and then precisely analyzes thermal distribution. A numerical analysis was performed to compare to the measurement method. The experimental results and the analysis shows the system can be used for thermal measurement in a micro scale.

Copyright © 2013 by ASME



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