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Mold Alignment System for Double-Sided Micro Hot Embossing Using Kinematic Constraints

[+] Author Affiliations
Glenn Conner, Devanda Lek, Juan A. Gomez, In-Hyouk Song, Byoung Hee You

Texas State University, San Marcos, TX

Taehyun Park

Kyungnam University, Changwon, Gyeongsan, Korea

Paper No. IMECE2013-63670, pp. V010T11A035; 5 pages
  • ASME 2013 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro- and Nano-Systems Engineering and Packaging
  • San Diego, California, USA, November 15–21, 2013
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5639-0
  • Copyright © 2013 by ASME


A cost effective alignment and positioning system was developed for double-sided hot embossing processes using kinematic principles. Alignment tooling located and transferred the top mold insert location to the proper location for the complementary mold insert and hot embossing was performed. The samples were checked for alignment accuracy and consistency. Adjustments were made and sampling repeated and measured. Results showed the alignment system can improve the locating and positioning of the complementary mold insert in relation to the top in a repeatable and cost effective manner.

Copyright © 2013 by ASME
Topics: Kinematics , Embossing



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