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3D Packaging Materials Based on Graphite Nanoplatelet and Aluminum Nitride Nanocomposites

[+] Author Affiliations
Srilakshmi Lingamneni, Kenneth E. Goodson

Stanford University, Stanford, CA

Amy M. Marconnet

Massachusetts Institute of Technology, Cambridge, MA

Paper No. IMECE2013-66419, pp. V010T11A021; 6 pages
  • ASME 2013 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro- and Nano-Systems Engineering and Packaging
  • San Diego, California, USA, November 15–21, 2013
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5639-0
  • Copyright © 2013 by ASME


Nanostructured composites with efficient percolation networks are promising candidates for packaging materials due to their high thermal conductivity. In this study, we investigate the thermal conductivity of composites consisting of a combination of exfoliated graphene nanoplatelet (xGNP) and aluminum nitride (AlN) particles in polyvinylidine fluoride (PVDF) matrix. The surfaces of the AlN particles are treated with silane to reduce the interfacial thermal resistance at particle-matrix boundary. Samples with 50 vol% AlN and 2 vol% xGNP showed an order of magnitude enhancement in thermal conductivity. AlN composites (with and with out xGNP) showed evidence of effective percolation pathways for AlN vol % over ∼40.

Copyright © 2013 by ASME



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