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Development of Direct Printing/Curing Process for 3D Structural Electronics

[+] Author Affiliations
Yanfeng Lu, Morteza Vatani, Jae-Won Choi

The University of Akron, Akron, OH

Ho-Chan Kim

Andong National University, Andong, South Korea

Rae-Chan Lee

Dae-Kwang Tech, Inc., Busan, South Korea

Paper No. IMECE2013-63068, pp. V02AT02A005; 5 pages
doi:10.1115/IMECE2013-63068
From:
  • ASME 2013 International Mechanical Engineering Congress and Exposition
  • Volume 2A: Advanced Manufacturing
  • San Diego, California, USA, November 15–21, 2013
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5618-5
  • Copyright © 2013 by ASME

abstract

3D structural electronics is a new paradigm in fabricating electronics with high design complexity. Basically, manufacturing of 3D structural electronics consists of several processes: structure building, wire creation, and pick-and-place of electrical components. In this work, a 3D structure was built in a commercial AM machine, and conductive wires were created on the 3D structure with a predetermined design of an electronic circuit. Generally, 2D wire paths are projected to a 3D surface, and a tool path for the wire is generated in advance. And a direct printing device follows the tool path to draw the conductive wires on the surface, while a direct curing device simultaneously hardens the created wires using thermal/radiation energy. This direct printing/curing device was developed by combining a micro-dispensing device and a light focusing module installed in a motorized xyz stage. Several experiments were accomplished using photocrosslinkable materials filled with carbon nanotubes (CNTs). Finally, a 3D electronics prototype was fabricated to show the compelling evidence that the suggested manufacturing methods and materials would be promising in manufacturing 3D structural electronics.

Copyright © 2013 by ASME

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