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Dynamics Modeling and Identification of a Dual-Blade Wafer Handling Robot

[+] Author Affiliations
Xiaowen Yu, Cong Wang, Masayoshi Tomizuka

University of California, Berkeley, CA

Yu Zhao

Tsinghua University, Beijing, China

Paper No. DSCC2013-3896, pp. V003T39A004; 7 pages
  • ASME 2013 Dynamic Systems and Control Conference
  • Volume 3: Nonlinear Estimation and Control; Optimization and Optimal Control; Piezoelectric Actuation and Nanoscale Control; Robotics and Manipulators; Sensing; System Identification (Estimation for Automotive Applications, Modeling, Therapeutic Control in Bio-Systems); Variable Structure/Sliding-Mode Control; Vehicles and Human Robotics; Vehicle Dynamics and Control; Vehicle Path Planning and Collision Avoidance; Vibrational and Mechanical Systems; Wind Energy Systems and Control
  • Palo Alto, California, USA, October 21–23, 2013
  • Conference Sponsors: Dynamic Systems and Control Division
  • ISBN: 978-0-7918-5614-7
  • Copyright © 2013 by ASME


This paper presents the dynamics modeling and dynamic identification of a dual-blade wafer handling robot. An explicit form dynamic model for this 8-link parallel robot is proposed. The dynamic model is transformed into a decoupled form to enable dynamic parameters identification with least-square regression. A well conditioned trajectory is chosen for identification experiment. Both viscous friction and Coulomb friction are considered to make the model more reliable. Model has been validated by experiments.

Copyright © 2013 by ASME



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