0

Full Content is available to subscribers

Subscribe/Learn More  >

Thermal Performance of Microchannels With Dimples for Electronics Cooling

[+] Author Affiliations
Hui Lu, Liang Gong, Minghai Xu

China University of Petroleum, Qingdao, Shandong, China

Paper No. MNHMT2013-22198, pp. V001T11A010; 8 pages
doi:10.1115/MNHMT2013-22198
From:
  • ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
  • ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
  • Hong Kong, China, December 11–14, 2013
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-3615-4
  • Copyright © 2013 by ASME

abstract

The thermal management of integrated circuits becomes more and more serious since the density of transistors grows gradually. Recently, a new cooling method is dedicated to develop microchannel heat sink with high integrated and high cooling efficiency. In view of above purpose, the heat transfer enhancement and pressure drop reduction in microchannel with dimples are investigated in this paper. A single module of 1mm×1mm×20mm with a microchannel was employed, which hydraulic diameter and aspect ratio are 500 μm and 2:1 respectively. For replacing the running integrated circuits, a constant heat flux of 1W/mm2 was arranged on the bottom of the heat sink. Six different types of microchannels with dimples were designed and numerically studied under the condition of laminar flow. The results show that dimple could enhance heat transfer and decrease flow resistance under the condition of laminar flow. Compared with traditional microchannel heat sink, dimple-microchannel heat sink has stronger cooling capacity, could be an attractive choice for cooling of future microelectronics.

Copyright © 2013 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In