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Temporal Effect and Transient Simulation of Thin Liquid Film in Micro Channels

[+] Author Affiliations
Yu-Yan Jiang, Da-Wei Tang

Chinese Academy of Sciences, Beijing, China

Paper No. MNHMT2013-22123, pp. V001T04A005; 7 pages
  • ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
  • ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
  • Hong Kong, China, December 11–14, 2013
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-5615-4
  • Copyright © 2013 by ASME


The evaporation and heat transfer of thin liquid film are crucial factors affecting on the heat transfer performance of boiling bubbles or slugs. For boiling in micro-channels, the flash evaporation of the liquid film may give rise to boiling instability, and the dry-out of the film leads to serious deterioration of the heat transport. The thin liquid film has multi-scale transitions, and hence the phase change and fluid dynamics need to be solved by special governing equations and numerical algorithm. The numerical studies to date have solved the steady state distribution of the film, but the difficulty consists in the transient simulation of time-variant liquid films. In the present study, unsteady form governing equations are developed. With inclusion of the temporal terms, we conducted transient simulations for flat liquid films formed during the flow boiling in micro-channels. The model predicts the developing of drying spot during growth of elongated bubbles. The results show that the film thickness and distribution change quickly in a growth period, which are functions of the heat flux, mass flow rate and the other parameters. The quantitative assessment of these effects helps to clarify the mechanism of boiling instability and the conditions for the occurrence of critical heat flux (CHF). The simulation needs special numerical scheme for time marching and stabilization treatment for the nonlinear terms, where the numerical accuracy and the significance of the temporal effects are also discussed.

Copyright © 2013 by ASME



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